BOOKS (CHAPTERS):

Power ELectroncis Handbook, ed. M. H. Rashid, Academic Press, New York, chapter: "Packaging of Smart Power Electronic Devices and Modules," in preparation.

REFEREED JOURNAL PUBLICATIONS: (Nov. 1998)

1. "Optimally Selecting Packaging Technologies and Circuit Partitions Based on Cost and Performance," D.C. Hopkins and J.B. Jacobsen, submitted 2000 IEEE Trans. on Power Electronics
2. "Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package," D. C. Hopkins, J. M. Pitarressi and J. A. Karker, invited and under submission, Int'l Jour. on Microelectronics Reliability, 1998.
3. "Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness," D. C. Hopkins and J. M. Pitarressi, under review Int’l Jour. of Microcircuits and Electronic Packaging, 1998.
4. "Definition and Small–Signal Modelling of Transitional Converters," J. A. Young and D. C. Hopkins, final draft for submission to IEEE Trans. on Industrial Electronics.
5. "A Transitional Push–Pull Converter for Power Factor Correction," J. A. Young and D. C. Hopkins, draft for submission to IEEE–Trans. On Power Electronics.
6. "Power Electronics Packaging," D. C. Hopkins, Guest Editor, Advancing Microelectronics Magazine, published by Int’l Microelectronics and Packaging Soc., Reston, VA, Vol. 24, No.1, p. 10, January/February 1997.
7. "Analysis and Control of a Resonant–Switched Self–Oscillating Converter," F. X. Li and D. C. Hopkins, for submission to IEEE–Trans. On Power Electronics.
8. "Optimizing Conductor Thickness in Power Hybrid Circuits," D. C. Hopkins and S. H. Bhavnani, Int’l Jour. of Microcircuits and Electronic Packaging, pp. 293-301, 3rd Qtr., 1994.
9. "Effect of Metalization Thickness on Thermal Conductance of a First-Level Power Hybrid Structure," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Int’l Jour. of Microcircuits and Electronic Packaging, pp. 189-193, 2Qtr., 1993.
10. "Extension of Battery Life via Charge Equalization Control," S. T. Hung, D. C. Hopkins and C. R. Mosling, IEEE Trans. on Industrial Electronics. Vol. 40, No. 1, pp. 96 - 104, February, 1993.
11. "Dynamic Equalization During Charging of Serial Energy Storage Elements," D.C. Hopkins, C. R. Mosling and S. T. Hung, IEEE Trans. on Industry Applications., Vol. 29, No. 2, pp. 363 – 368, March/April, 1993.
12. "Plated Copper on Ceramic Substrates for Power Hybrid Circuits," R.W. Johnson, R. Weeks, D.C. Hopkins, J. Muir , and J.R. Williams, Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, pp. 503-536, December 1989.
13. "Hybridized Off-Line 2-MHz Zero-Current-Switched Quasi-Resonant Converter," D.C. Hopkins, M.M. Jovanovic, F.W. Stephenson and F.C. Lee, IEEE Transactions on Power Electronics, Vol.4, No.1, pp. 147-154, Jan. 1989.
14. "Evaluation and Design of Megahertz-Frequency Off-Line Zero-Current- Switched Quasi-Resonant Converters," M.M. Jovanovic, D.C. Hopkins and F.C. Lee, IEEE Transactions on Power Electronics, Vol.4, No.1, pp. 136-146, January 1989; First Place - Alabama Section, IEEE.
15. "Thick-Film Technique Helps Hybridized, 2 MHz ZC-QR Converter Achieve 78% Efficiency," Power Conversion & Intelligent Motion, Vol. 15, No. 7, pp 57-66, July 1989.
16. "Designing Hybrid Power Supplies," Powertechnics Magazine, Vol. 5, No. 6, pp. 31-34, June 1989.
17. "Development of a High-Density, Off-Line, Quasi-Resonant Converter Using Hybrid Techniques," Ph.D. Dissertation, Virginia Polytechnic Institute and State University, 1988.
18. "Characteristic Input Harmonics of DC-DC Converters and their Effects on Input Filter Design," R.L. Steigerwald and D.C. Hopkins, IEEE Transactions on Industrial Electronics and Control Instrumentation, Vol. IECI-28, pp 73-82, May 1981.
19. "Construction and Energy Loss of a Vacuum-Arc Switched Series Inverter," M.S. Thesis, State University of New York at Buffalo, February 1978.

REFEREED CONFERENCE PROCEEDINGS: (Nov. 1998)

1. "Packaging Factors for Next Generation High Voltage, High Temperature Power Electronics Modules," J.S. Bowers, D.C. Hopkins and W.J. Sarjeant, Proc. of the High Temperature Electronics Conference, Albuquerque, NM June, 2000.
2. "A Four - Dimensional Road-Mapping Framework for Power Packaging Technology," D. C. Hopkins, S. C. O Mathóna, A. N. Alderman, Proc. of the 1998 IMAPS Int’l Symp. on Microelectronics, San Diego, CA, Nov. 1-4, 1998.
3. "A High Speed Pulser Thyristor," A. H. Craig, D. C. Hopkins and J. C. Driscoll, Proc. of the Int’l Applied Power Electronics Conference, Anaheim, CA, February 15-19, 1998.
4. "Power Packaging of a 12 kV, 240 ° C, Passive Electronic Module," J. S. Bowers, D. C. Hopkins and W. J. Sarjeant, Proc. of the Int’l Applied Power Electronics Conference, Anaheim, CA, February 15-19, 1998.
5. "A Framework for Developing Power Electronic Packaging," D. C. Hopkins, S. C. OMathuna, A. N. Alderman and J. Flannery, Proc. of the Int’l Applied Power Electronics Conference, Anaheim, CA, February 15-19, 1998; Plenary Session
6. "Thermal Resistance and Stress due to Variations in Layer Thicknesses," D. C. Hopkins, J. M. Pitarressi and J. A. Karker, Proc. of the 1997 ISHM (IMAPS) Int’l Symp. on Microelectronics, Philadelphia, PA, Oct. 12-16, 1997.
7. "Packaging Issues for next Generation High Voltage, High Temperature Power Electronics Modules," J. S. Bowers, D. C. Hopkins and W. J. Sarjeant, Proc. of the Int’l Applied Power Electronics Atlanta, GA, February 23-27, 1997.
8. "System Design Considerations for using a Direct–Attached–Ceramic MMC Power Package," D. C. Hopkins, J. M. Pitarressi, D. R. Fridline and J. A. Karker, Proc. of 32nd Int’l Power Conversion Conference, Nürnberg, Germany, pp. 683–690, May 21–23, 1996.
9. "Development of a Three Dimensional Power Circuit Package for Aircraft Applications," D. C. Hopkins, R. Revis, 1994 ISHM Int’l Symp. on Microelectronics, Boston, MA, pp. 124–128, November 15–17, 1994; awarded Best Paper of Session.
10. "A Mathematical Approach to Minimize the Total Mass of a Space Based Power System by Using Multivariate Nonlinear Optimization," D. C. Hopkins, M. Sarkar, 29th Intersociety Energy Conversion Engineering Conf., Monterey, CA, August 7–12, 1994.
11. "Synthesis of a New Class of Converters That Utilize Energy Recirculation," D. C. Hopkins and D. W. Root, Proc. of the 1994 IEEE Power Electronics Specialists Conference, Taipei, Taiwan, pp. 1167–1172, June 20–24, 1994.
12. "Determining Conductor Thickness in Power Circuits that Operate at Long Wavelength Frequencies," D. C. Hopkins and S. H. Bhavnani, Proc. of the 1993 ISHM Int’l Symp. on Microelectronics, Dallas, TX, pp. 656–661, November 9-11, 1993.
13. "Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN, Al2O3 and BeO Assemblies," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Proc. of the 1992 ISHM Int’l Symp. on Microelectronics, San Francisco, CA, pp. 577-583, October 19-21, 1992; awarded Best Paper of Session.
14. "Numerical Modeling and Experimental Comparison of Copper Bonded AlN, Al2O3 and BeO Power Hybrid Structures," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Proc. of the 1992 Int’l Electronics Packaging Conf., Austin, TX, September 27-30, 1992.
15. "The Use of Equalizing Converters for Serial Charging of Long Battery Strings," D. C. Hopkins, C. R. Mosling, S. T. Hung, IEEE Applied Power Electronics Conference, Dallas, Texas, March 10-15, 1991; Invited Paper.
16. "The Effects of Power Hybridization on Power Electronic Circuits," D. C. Hopkins, ISHM Int'l Symposium on Microelectronics Proceedings, Baltimore, MD, pp. 647-654, October 1989.
17. "The Microelectronics Program at Auburn University," R. W. Johnson, D.C. Hopkins and R. C. Jaeger, ISHM Int'l Symposium on Microelectronics Proceedings, Baltimore, MD, pp. 367-375, October 1989; Best Paper of Session.
18. "Power-Hybrid Design of a High-Frequency ZCS-QRC," D.C. Hopkins, M. M. Jovanovic, F.C. Lee and F. W. Stephenson, Proc. of the Fourth Annual High Frequency Power Conversion Conference, Naples, FL, pp. 304-317, May 14-18, 1989.
19. "Plated Copper on Ceramic for Power Hybrid Applications," R. Weeks, R. W. Johnson and D.C. Hopkins, 39th Electronic Components Conference Record, Houston, TX, May 1989.
20. "Thick-Film Power Hybridization of Switchmode Power Circuits," D, C, Hopkins, Proceedings of the IEEE Applied Power Electronics Conference, Baltimore, MD, pp. 249-255, March 13-17, 1989.
21. "Printing of Thick Thick-Film Conductors for Power Hybrid Circuits," D.C. Hopkins, F.W. Stephenson and F.C. Lee, ISHM Int'l Symposium on Microelectronics Proceedings, Seattle, WA, pp. 95-101, October 1988; Best Paper of Session.
22. "Determination of Conductor Thickness and Width for Power-Hybrid Circuits," D. C. Hopkins, F. W. Stephenson and F. C. Lee, Proc. of the Sixth Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 71-83 September 26-28, 1988.
23. "Off-Line ZCS-QRC Thick-Film Hybrid Circuit," D. C. Hopkins, F. W. Stephenson and F. C. Lee, Proc. of the Sixth Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 71-83 September 26-28, 1988.
24. "Design Aspects for High-Frequency Off-Line Quasi-Resonant Converter," M. M. Jovanovic, D.C. Hopkins and F. C. Lee, Proceedings of the Second Annual High Frequency Power Conversion Conference, Washington, D.C., pp. 83-97, April 1987.
25. "Two-Megahertz Off-Line Hybridized Quasi-Resonant Converter," D.C. Hopkins, M. M. Jovanovic, F.W. Stephenson and F.C. Lee, Proceedings of the IEEE Applied Power Electronics Conference, pp. 105-114, March 1987.
26. "One-Megahertz, Off-Line Converter Hybridization," D. C. Hopkins, M. M. Jovanovic, F. W. Stephenson and F. C. Lee, Proc. of the Fourth Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 134-148, November 4-5, 1986.
27. "Status of Power Devices, IC's and Support Chips," D. C. Hopkins, Proc. of the Second Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 2-9, September 13-14 1984.
28. "Status of Semiconductor Power Switching Devices," D. C. Hopkins, Proc. of the First Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 82-91, October 12-13, 1983.
29. "Protective Level Comparisons of Voltage Transient-Suppressors (120 Vac Type)," ITT Research Institute - Electrical Overstress Electrostatic Discharge Symposium Proceedings, San Diego, CA, pp. 35-43, September 1980.
30. "A Multi-Megawatt Vacuum-Arc Switched Invertor for Airborne Applications," with R.N. Miller, et al., Proceedings of the 13th Pulse Power Modulator Symposium, June 1978.
31. "Recent Results of Vacuum-Arc Switched Multi-Megawatt Inverter Tests," with A. S. Gilmour, et al., IEEE Pulsed Power Conference Proceedings, November 1976.