REFERENCE MATERIAL FOR DR. DOUGLAS C. HOPKINS' IEEE FELLOW NOMINATION

Thank you for providing a Letter of Reference or Letter of Endorsement for Dr. Hopkins

  • Chronological narrative of Dr. Hopkins' technical developments (Excerpts were used in the 'Nomination' form)

  • Dr. Hopkins' Full CV

  • Publications Only from Dr. Hopkins' Full CV

    • BELOW ARE PUBLICATIONS REFERENCED IN PART-7 OF NOMINATION FORM
    (Only conference publications availed themselves for awards and distinctions. However, most conference topics have associated journal publications. See CV for journal listings.)

  • "Aluminum-Based High-Temperature (>200C) Packaging...-IMAPS'06"
  • "Aluminum-Based High-Temperature (>200C) Packaging...-APEC'06"

  • "Optimally Selecting Packaging Technologies...-APEC'00"

  • "A Framework for Developing Power Electronic Packaging"-IMAPS'98
  • "A Framework for Developing Power Electronic Packaging"-APEC'98

  • "Development of a Three Dimensional Power Circuit Package..."-IMAPS'94

  • "Thermal Performance Comparison and Metallurgy..."-IMAPS'92

  • "The Use of Equalizing Converters for Serial Charging of Long Battery Strings"-APEC'91

  • "Printing of Thick Thick-Film Conductors for Power Hybrid Circuits"-IMAPS'88

    • ADDITIONAL PUBLICATION EMPHASIZED IN NOMINATION -

  • "Synthesis of a New Class of Converters That Utilize Energy Recirculation"-PESC'94



    • For more information contact

    Dr. Doug Hopkins
    716-645-3115, ext 1142 (Tue - Fri)
    607-729-9949 (Sat - Mon)

    Prof. Cemal Basaran
    Professor, University at Buffalo
    Director, Electronic Packaging Laboratory
    716-645-2114, ext 2429