REFEREED JOURNAL PUBLICATIONS: (May 2010)
- "A High Temperature SiC-Based Solid State Power Controller for Microgrid Applications," Yuanbo Guo, Krishna P. Bhat, Douglas C. Hopkins,in preparation: IEEE Trans. on Power Electronics, July 2010
- "A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment," Krishna P. Bhat, Douglas C. Hopkins, Kwang Oh, IEEE Trans. on Industry Applications, submitted October 2010
- "Electromigration Time to Failure of SnAgCuNi Solder Joints," C. Basaran, S. Li, D. C. Hopkins, and D. Veychard, J. of Applied Physics 106, 013707 (2009)
- "A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks," A. Hosny, D. C. Hopkins, Z. B. Gay, and M. Safiuddin, in revision, Trans. on Power Engineering, May 2008
- "Effect of Thermomigration on Lead-Free Solder Joint Mechanical Properties," Mohd F. Abdulhamid, Cemal Basaran and Douglas C. Hopkins, IEEE Trans on Advanced Packaging, submitted Apr �07
- "Experimental Thermomigration Studies in Lead-Free Flip Chip Solder Joints," Mohd F. Abdulhamid, Cemal Basaran , and Douglas C. Hopkins, Appl. Physics Ltrs, August 2006.
- "Experimental damage mechanics of micro/power electronics solder joints under electric current stresses," Hua Ye, Cemal Basaran, Douglas C. Hopkins, Int. J. of Damage Mechanics, v 15, n 1, January, 2006, p 41-67
- "Flip chip solder joint failure modes," C. Basaran, H. Ye, D.C. Hopkins, D. Frear, J.K. Lin, Advanced Packaging, v 14, n 10, October, 2005, p 14-19
- "Failure modes of flip chip solder joints under high electric current density," C. Basaran, H. Ye, D.C. Hopkins, D. Frear, J.K. Lin, Trans. of the ASME. Journal of Electronic Packaging, v 127, n 2, June 2005, p 157-63
- "Mechanical implications of high current densities in flip-chip solder joints," C. Basaran, H. Ye, D.C. Hopkins, D., Int. Journal of Damage Mechanics, v 13, n 4, Oct. 2004, p 335-45
- "Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation I," C. Basaran, H. Ye, D.C. Hopkins, Int. J. of Solids and Structures, vol. 41, n 18-19, pp. 4939-4958, September 2004.
- "Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation II," Ye, H. Basaran, C. and Hopkins, D., Int. J. of Solids and Structures, vol. 41, n 18-19, pp. 4959-4973, September 2004.
- "Failure Modes of Flip-Chip Solder Joints under High Electric Current Stressing", Ye, H., Basaran, C., and Hopkins, D.C., Trans. of the ASME - J. of Electronic Packaging August 24, 2004
- "Mechanical implications of high current densities in flip-chip solder joints," Ye, H., Basaran, C. and Hopkins, D., Int. J. of Damage Mechanics, v. 13, n 4 October 2004. p 335-345.
- "Pb Phase Coarsening in Eutectic Pb/Sn Flip Chip Solder Joint under Electric Current Stressing," Ye, H., Basaran, C., and Hopkins, D.C., Int.. J. of Solids & Structures, v. 41, n 9-10, May 2004, pp. 2743-2755.
- "Measurement of High Electrical Current Density Effects in Solder Joints," Ye. H., Hopkins, D.C., and Basaran, C., Microelectronics Reliability, Vol. 43, issue 12, pp. 2021-2029, December 2003.
- "Damage Mechanics of Microelectronics Solder Joints under High Current Densities," Ye, H., Basaran, C., and Hopkins, D., Int. J. of Solids & Structures, vol. 40, no. 15, pp. 4021-32, Jul 2003
- "Mechanical degradation of solder joints under current stressing," Ye, H., Basaran, C., and Hopkins, D.C., Int. J. of Solids & Structures, Vol 40 No 26, pp 7269-7284, November 2003.
- "Measurement of Electrical Current Density Effects in Solder Joints," Hua Ye, Douglas C. Hopkins, Cemal Basaran, Advancing Microelectronics, Vol. 30, No. 5, Sept-Oct 2003
- "Numerical Simulation Of Stress Evolution During Electromigration in IC Interconnect Lines," Ye, H., Basaran, C., and Hopkins, D.C., IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3 pp.673-681, September 2003.
- "Mechanical Implications of High Current Densities in Flip Chip Solder Joints", Ye, H., Basaran, C., and Hopkins, D.C., Int. J. of Damage Mechanics, August 2003
- "Flip Chip and BGA Solder Joint Reliability", Hua Ye, Cemal Basaran, Douglas C. Hopkins, Heng Liu and Alexander Cartright, Advanced Packaging, vol.12, no.5, pp.17-19, May 2003
- "Measuring Joint Reliability: Applying the Moire Interferometry Technique," Ye, H., Basaran, C., and Hopkins, D.C., Advanced Microelectronics Magazine, pp. 17-21,May 2003
- "Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric-Current Stressing," H. Ye, C. Basaran, D.C. Hopkins, Applied Physics Letters, vol. 82, no.8, pp. 1045-1047, Feb.2003.
- "Optimally Selecting Packaging Technologies and Circuit Partitions Based on Cost and Performance," D.C. Hopkins and J.B. Jacobsen, submitted 2000 IEEE Trans. on Power Electronics
- "Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package," D. C. Hopkins, J. M. Pitarressi and J. A. Karker, invited and under submission, Int. Jour. on Microelectronics Reliability, 1998.
- "Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness," D. C. Hopkins and J. M. Pitarressi, under review Int’l Jour. of Microcircuits and Electronic Packaging, 1998.
- "Definition and Small–Signal Modelling of Transitional Converters," J. A. Young and D. C. Hopkins, final draft for submission to IEEE Trans. on Industrial Electronics.
- "A Transitional Push–Pull Converter for Power Factor Correction," J. A. Young and D. C. Hopkins, draft for submission to IEEE–Trans. On Power Electronics.
- "Power Electronics Packaging," D. C. Hopkins, Guest Editor, Advancing Microelectronics Magazine, published by Int’l Microelectronics and Packaging Soc., Reston, VA, Vol. 24, No.1, p. 10, January/February 1997.
- "Analysis and Control of a Resonant–Switched Self–Oscillating Converter," F. X. Li and D. C. Hopkins, for submission to IEEE–Trans. On Power Electronics.
- "Optimizing Conductor Thickness in Power Hybrid Circuits," D. C. Hopkins and S. H. Bhavnani, Int’l Jour. of Microcircuits and Electronic Packaging, pp. 293-301, 3rd Qtr., 1994.
- "Effect of Metalization Thickness on Thermal Conductance of a First-Level Power Hybrid Structure," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Int’l Jour. of Microcircuits and Electronic Packaging, pp. 189-193, 2Qtr., 1993.
- "Extension of Battery Life via Charge Equalization Control," S. T. Hung, D. C. Hopkins and C. R. Mosling, IEEE Trans. on Industrial Electronics. Vol. 40, No. 1, pp. 96 - 104, February, 1993.
- "Dynamic Equalization During Charging of Serial Energy Storage Elements," D.C. Hopkins, C. R. Mosling and S. T. Hung, IEEE Trans. on Industry Applications., Vol. 29, No. 2, pp. 363 – 368, March/April, 1993.
- "Plated Copper on Ceramic Substrates for Power Hybrid Circuits," R.W. Johnson, R. Weeks, D.C. Hopkins, J. Muir , and J.R. Williams, Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, pp. 503-536, December 1989.
- "Hybridized Off-Line 2-MHz Zero-Current-Switched Quasi-Resonant Converter," D.C. Hopkins, M.M. Jovanovic, F.W. Stephenson and F.C. Lee, IEEE Transactions on Power Electronics, Vol.4, No.1, pp. 147-154, Jan. 1989.
- "Evaluation and Design of Megahertz-Frequency Off-Line Zero-Current- Switched Quasi-Resonant Converters," M.M. Jovanovic, D.C. Hopkins and F.C. Lee, IEEE Transactions on Power Electronics, Vol.4, No.1, pp. 136-146, January 1989; First Place - Alabama Section, IEEE.
- "Thick-Film Technique Helps Hybridized, 2 MHz ZC-QR Converter Achieve 78% Efficiency," Power Conversion & Intelligent Motion, Vol. 15, No. 7, pp 57-66, July 1989.
- "Designing Hybrid Power Supplies," Powertechnics Magazine, Vol. 5, No. 6, pp. 31-34, June 1989.
- "Development of a High-Density, Off-Line, Quasi-Resonant Converter Using Hybrid Techniques," Ph.D. Dissertation, Virginia Polytechnic Institute and State University, 1988.
- "Characteristic Input Harmonics of DC-DC Converters and their Effects on Input Filter Design," R.L. Steigerwald and D.C. Hopkins, IEEE Transactions on Industrial Electronics and Control Instrumentation, Vol. IECI-28, pp 73-82, May 1981.
- "Construction and Energy Loss of a Vacuum-Arc Switched Series Inverter," M.S. Thesis, State University of New York at Buffalo, February 1978.