PUBLICATIONS
 

REFEREED JOURNAL PUBLICATIONS: (May 2010)

  1. "A High Temperature SiC-Based Solid State Power Controller for Microgrid Applications," Yuanbo Guo, Krishna P. Bhat, Douglas C. Hopkins,in preparation: IEEE Trans. on Power Electronics, July 2010
  2. "A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment," Krishna P. Bhat, Douglas C. Hopkins, Kwang Oh, IEEE Trans. on Industry Applications, submitted October 2010
  3. "Electromigration Time to Failure of SnAgCuNi Solder Joints," C. Basaran, S. Li, D. C. Hopkins, and D. Veychard, J. of Applied Physics 106, 013707 (2009)
  4. "A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks," A. Hosny, D. C. Hopkins, Z. B. Gay, and M. Safiuddin, in revision, Trans. on Power Engineering, May 2008
  5. "Effect of Thermomigration on Lead-Free Solder Joint Mechanical Properties," Mohd F. Abdulhamid, Cemal Basaran and Douglas C. Hopkins, IEEE Trans on Advanced Packaging, submitted Apr �07
  6. "Experimental Thermomigration Studies in Lead-Free Flip Chip Solder Joints," Mohd F. Abdulhamid, Cemal Basaran , and Douglas C. Hopkins, Appl. Physics Ltrs, August 2006.
  7. "Experimental damage mechanics of micro/power electronics solder joints under electric current stresses," Hua Ye, Cemal Basaran, Douglas C. Hopkins, Int. J. of Damage Mechanics, v 15, n 1, January, 2006, p 41-67
  8. "Flip chip solder joint failure modes," C. Basaran, H. Ye, D.C. Hopkins, D. Frear, J.K. Lin, Advanced Packaging, v 14, n 10, October, 2005, p 14-19
  9. "Failure modes of flip chip solder joints under high electric current density," C. Basaran, H. Ye, D.C. Hopkins, D. Frear, J.K. Lin, Trans. of the ASME. Journal of Electronic Packaging, v 127, n 2, June 2005, p 157-63
  10. "Mechanical implications of high current densities in flip-chip solder joints," C. Basaran, H. Ye, D.C. Hopkins, D., Int. Journal of Damage Mechanics, v 13, n 4, Oct. 2004, p 335-45
  11. "Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation I," C. Basaran, H. Ye, D.C. Hopkins, Int. J. of Solids and Structures, vol. 41, n 18-19, pp. 4939-4958, September 2004.
  12. "Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation II," Ye, H. Basaran, C. and Hopkins, D., Int. J. of Solids and Structures, vol. 41, n 18-19, pp. 4959-4973, September 2004.
  13. "Failure Modes of Flip-Chip Solder Joints under High Electric Current Stressing", Ye, H., Basaran, C., and Hopkins, D.C., Trans. of the ASME - J. of Electronic Packaging August 24, 2004
  14. "Mechanical implications of high current densities in flip-chip solder joints," Ye, H., Basaran, C. and Hopkins, D., Int. J. of Damage Mechanics, v. 13, n 4 October 2004. p 335-345.
  15. "Pb Phase Coarsening in Eutectic Pb/Sn Flip Chip Solder Joint under Electric Current Stressing," Ye, H., Basaran, C., and Hopkins, D.C., Int.. J. of Solids & Structures, v. 41, n 9-10, May 2004, pp. 2743-2755.
  16. "Measurement of High Electrical Current Density Effects in Solder Joints," Ye. H., Hopkins, D.C., and Basaran, C., Microelectronics Reliability, Vol. 43, issue 12, pp. 2021-2029, December 2003.
  17. "Damage Mechanics of Microelectronics Solder Joints under High Current Densities," Ye, H., Basaran, C., and Hopkins, D., Int. J. of Solids & Structures, vol. 40, no. 15, pp. 4021-32, Jul 2003
  18. "Mechanical degradation of solder joints under current stressing," Ye, H., Basaran, C., and Hopkins, D.C., Int. J. of Solids & Structures, Vol 40 No 26, pp 7269-7284, November 2003.
  19. "Measurement of Electrical Current Density Effects in Solder Joints," Hua Ye, Douglas C. Hopkins, Cemal Basaran, Advancing Microelectronics, Vol. 30, No. 5, Sept-Oct 2003
  20. "Numerical Simulation Of Stress Evolution During Electromigration in IC Interconnect Lines," Ye, H., Basaran, C., and Hopkins, D.C., IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3 pp.673-681, September 2003.
  21. "Mechanical Implications of High Current Densities in Flip Chip Solder Joints", Ye, H., Basaran, C., and Hopkins, D.C., Int. J. of Damage Mechanics, August 2003
  22. "Flip Chip and BGA Solder Joint Reliability", Hua Ye, Cemal Basaran, Douglas C. Hopkins, Heng Liu and Alexander Cartright, Advanced Packaging, vol.12, no.5, pp.17-19, May 2003
  23. "Measuring Joint Reliability: Applying the Moire Interferometry Technique," Ye, H., Basaran, C., and Hopkins, D.C., Advanced Microelectronics Magazine, pp. 17-21,May 2003
  24. "Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric-Current Stressing," H. Ye, C. Basaran, D.C. Hopkins, Applied Physics Letters, vol. 82, no.8, pp. 1045-1047, Feb.2003.
  25. "Optimally Selecting Packaging Technologies and Circuit Partitions Based on Cost and Performance," D.C. Hopkins and J.B. Jacobsen, submitted 2000 IEEE Trans. on Power Electronics
  26. "Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package," D. C. Hopkins, J. M. Pitarressi and J. A. Karker, invited and under submission, Int. Jour. on Microelectronics Reliability, 1998.
  27. "Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness," D. C. Hopkins and J. M. Pitarressi, under review Int’l Jour. of Microcircuits and Electronic Packaging, 1998.
  28. "Definition and Small–Signal Modelling of Transitional Converters," J. A. Young and D. C. Hopkins, final draft for submission to IEEE Trans. on Industrial Electronics.
  29. "A Transitional Push–Pull Converter for Power Factor Correction," J. A. Young and D. C. Hopkins, draft for submission to IEEE–Trans. On Power Electronics.
  30. "Power Electronics Packaging," D. C. Hopkins, Guest Editor, Advancing Microelectronics Magazine, published by Int’l Microelectronics and Packaging Soc., Reston, VA, Vol. 24, No.1, p. 10, January/February 1997.
  31. "Analysis and Control of a Resonant–Switched Self–Oscillating Converter," F. X. Li and D. C. Hopkins, for submission to IEEE–Trans. On Power Electronics.
  32. "Optimizing Conductor Thickness in Power Hybrid Circuits," D. C. Hopkins and S. H. Bhavnani, Int’l Jour. of Microcircuits and Electronic Packaging, pp. 293-301, 3rd Qtr., 1994.
  33. "Effect of Metalization Thickness on Thermal Conductance of a First-Level Power Hybrid Structure," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Int’l Jour. of Microcircuits and Electronic Packaging, pp. 189-193, 2Qtr., 1993.
  34. "Extension of Battery Life via Charge Equalization Control," S. T. Hung, D. C. Hopkins and C. R. Mosling, IEEE Trans. on Industrial Electronics. Vol. 40, No. 1, pp. 96 - 104, February, 1993.
  35. "Dynamic Equalization During Charging of Serial Energy Storage Elements," D.C. Hopkins, C. R. Mosling and S. T. Hung, IEEE Trans. on Industry Applications., Vol. 29, No. 2, pp. 363 – 368, March/April, 1993.
  36. "Plated Copper on Ceramic Substrates for Power Hybrid Circuits," R.W. Johnson, R. Weeks, D.C. Hopkins, J. Muir , and J.R. Williams, Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, pp. 503-536, December 1989.
  37. "Hybridized Off-Line 2-MHz Zero-Current-Switched Quasi-Resonant Converter," D.C. Hopkins, M.M. Jovanovic, F.W. Stephenson and F.C. Lee, IEEE Transactions on Power Electronics, Vol.4, No.1, pp. 147-154, Jan. 1989.
  38. "Evaluation and Design of Megahertz-Frequency Off-Line Zero-Current- Switched Quasi-Resonant Converters," M.M. Jovanovic, D.C. Hopkins and F.C. Lee, IEEE Transactions on Power Electronics, Vol.4, No.1, pp. 136-146, January 1989; First Place - Alabama Section, IEEE.
  39. "Thick-Film Technique Helps Hybridized, 2 MHz ZC-QR Converter Achieve 78% Efficiency," Power Conversion & Intelligent Motion, Vol. 15, No. 7, pp 57-66, July 1989.
  40. "Designing Hybrid Power Supplies," Powertechnics Magazine, Vol. 5, No. 6, pp. 31-34, June 1989.
  41. "Development of a High-Density, Off-Line, Quasi-Resonant Converter Using Hybrid Techniques," Ph.D. Dissertation, Virginia Polytechnic Institute and State University, 1988.
  42. "Characteristic Input Harmonics of DC-DC Converters and their Effects on Input Filter Design," R.L. Steigerwald and D.C. Hopkins, IEEE Transactions on Industrial Electronics and Control Instrumentation, Vol. IECI-28, pp 73-82, May 1981.
  43. "Construction and Energy Loss of a Vacuum-Arc Switched Series Inverter," M.S. Thesis, State University of New York at Buffalo, February 1978.