PUBLICATIONS
 

REFEREED CONFERENCE PROCEEDINGS: (Mar 2011)

  1. "High Current and Thermal Transient Design of a SiC SSPC for Aircraft Application," Y. B. Guo, K. P. Bhat, A. Aravamudhan, D. C. Hopkins, D. R. Hazelmyer, IEEE Applied Power Electronics Conf., Ft. Worth, TX, Mar 6-10, 2011
  2. "Development and Testing of a 350˚C SiC MCPM with Cast Metal Matrix Composites", D. C. Hopkins, Y. B. Guo, A. Aravamudhan, J. D. Scofield, 2010 Int’l Electronics Packaging Symp., Niskayuna, NY, Sept. 9-10, 2010
  3. "Solid-State Protection: Dual-use for Microgrids," D. C. Hopkins, Advanced Energy Conf., New York, NY, Nov. 8-9, 2010
  4. "Augmenting Bucholz Relay Using Embedded Mems Gas Sensor," K. P. Bhat, D. C. Hopkins, IEEE 2010 IEEE PES Transmission and Distribution Conf., New Orleans, LA, April 19-22, 2010
  5. "A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment," Krishna P. Bhat, Douglas C. Hopkins, Kwang Oh, IEEE-Industry Applications Society Conference, Electrostatic Process Committee, Houston, TX, 3-7 October 2010
  6. "Development of A Sic SSPC Module with Advanced High Temperature Packaging," Douglas C Hopkins, Yuanbo Guo, Herbert E Dwyer, James D Scofield, High Temperature Electronics (HiTEC), May 11-13, 2010, Albuquerque, NM
  7. "Investigation of SiC Power Module Requirement for Smart Grid Applications," Y. Guo, PF Jao, G. Wang, Y. Du, S. Bhattacharya and D. C. Hopkins, 42th IMAPS Int'l Symp. on Microelectronics, San Jose, CA, November 1-5, 2009 Best Paper of Session
  8. "Electromigration Time to Failure of SnAgCuNi Solder Joints," Cemal Basaran, Shidong Li, Douglas C. Hopkins, and Damien Veychard, ASME InterPack 2009, San Francisco, CA, July 19-23, 2009
  9. "Assessment of Critical Issues for High Temperature, High Voltage Power Modules," D. C. Hopkins, Y. Guo, and PF Jao, FREEDM Syst Ctr Conf., Raleigh, NC, May 18-20, 2009
  10. "Investigation of High Electrical Gradients in High Voltage Power Modules," Y. Guo, PF. Jao and D. C. Hopkins, FREEDM Syst Ctr Conf., Raleigh, NC, May 18-20, 2009
  11. "Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints," M. Abdulhamid, D. C. Hopkins, C. Basaran, Int'l Electronics Packaging Symposium, Niskayuna, NY July 29 - 30, 2008
  12. "Stress Management in a High Temperature Multilayered Composite Structure," D C Hopkins, D W Kellerman, Int''l High Temperature Electronics Conf. (HiTEC 2008), Albuquerque, New Mexico, May 12-15, 2008
  13. "Solder Interconnect Electromigration Due to Time Varying Current Stressing," K.E. Enser, D.C. Hopkins, C. Basaran, Proc. of the 40th IMAPS Int'l Symp. on Microelectronics, San Jose, CA, November 10 - 15, 2007,
  14. "The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC," T. McKay, D.C. Hopkins, C. Basaran, Proc. of the 40th IMAPS Int'l Symp. on Microelectronics, San Jose, CA, November 10 - 15, 2007
  15. "Harsh Environment Thermal Management Using Aluminum-Based Packaging," T. McKay, D.C. Hopkins, C. Basaran, M.F. Abdulhamid, International Electronics Packaging Symposium, Niskayuna, NY Jul 31-Aug 01, 2007
  16. "IMC Effects in Solder from High Thermal Gradients Management ," M. F. Abdulhamid, D. C. Hopkins, C. Basaran, International Electronics Packaging Symposium, Niskayuna, NY Jul 31--Aug 01, 2007
  17. "A Review of Electromigration Under Time Varying Current Stressing," Kevin E. Enser, Douglas C. Hopkins, Cemal Basaran, SAE Int'l Symposium, Toronto, Canada, April 19, 2007
  18. "Aluminum-Based High-Temperature (>200¡C) Packaging for SiC Power Converters," D. C. Hopkins, D W. Kellerman, C. Basaran, J. Gomez, Proc. of the 39th IMAPS Int'l Symp. on Microelectronics, San Diego, CA, October 8-12, 2006, pp 734-741 Nominated Best Paper of Conference
  19. "Aluminum-Based High-Temperature (>200¡C) Packaging for SiC Power Converters," D. C. Hopkins, D W. Kellerman, C. Basaran, J. Gomez, Int'l High Temperature Electronics Conf. (HiTEC 2006), Santa Fe, New Mexico, May 15-18, 2006, invited speaker
  20. "Experimental study of thermomigration in lead-free nanoelectronics solder joints," Abdulhamid, Mohd F.; Basaran, Cemal; Hopkins, Douglas C., American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging, 2006, 5p
  21. "High-Temperature, High-Density Packaging of a 60kW Converter for >200¡C Embedded Operation," D. C. Hopkins, R. A. Wunderlich, D. W. Kellerman, Proc. of the Int'l Applied Power Electronics Conference, New Orleans, LA, March 19Ð23, 2006.
  22. "Implementing Digital Power Control In Automotive Alternators," C. Thondapu, D. C. Hopkins, G. Holguin, Digital Power Forum 2005, Boston MA, September 12-14, 2005
  23. "Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing," Hua Ye, Cemal Basaran, Douglas C. Hopkins, Minghui Lin, Proc. 55th Electronic Components and Technology (IEEE Cat. No. 05CH37635), 2005, pt. 2, p 1437-44 Vol. 2
  24. "Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation, " Basaran, C., Ye, H. and Hopkins D., 21st International Congress of Theoretical and Applied Mechanics, August 15-21, 2004, Warsaw, Poland.
  25. "Damage Mechanics of Microelectronics Solder Joints Under High Current Density," Ye, H., Basaran. C and Hopkins, D., Frear D., Jong-Kai Lin, The 54th Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV, v. 1, 2004. pp. 988-997
  26. "Pb Phase Growth in Eutectic Pb/Sn Flip Chip Solder Joint under Current Stressing", Ye, H., Basaran, C., and Hopkins, D.C., Proc. of 2003 Mechanics and Materials Conference, Scottsdale, AZ, June 17-20, 2003
  27. "Measurement and Effects of High Electrical Current Stress in Solder Joints," Ye, H., Hopkins, D.C., and Basaran, C., Proc. of the 35th International Symposium on Microelectronics, Denver, Colorado, 9-4-2002
  28. "Mechanical Implications of High Current Densities In Flip Chip Solder Joints," H. Ye, C. Basaran, and D.C. Hopkins, Proc. of International Mechanical Engineering Congress and Exposition, New Orleans, LA, November 17, 2002
  29. "Measurement and Effects of High Current Stress in Solder Joints," H. Ye, D.C. Hopkins, C. Basaran, Proc. of the 35th IMAPS Int'l Symp. on Microelectronics, Denver, CO, pp. 427-432, September, 4-6, 2002. Best Student Paper-Honorable Mention.
  30. "Reliability of Solder Joints Under Electrical Stressing," Ye, H., Basaran, C and Hopkins, D., Proc. Of the VIII th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 - June 1, 2002, San Diego, CA.
  31. "Reliability of Solder Joints under Electrical Stressing -Strain evolution of Solder joints," Ye, H., Basaran, C., Hopkins, D.C., and Cartwright, A., Proc. of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 29 May 2002
  32. "Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement," H. Ye, C. Basaran and D. Hopkins, IMAPS Int'l Conference on Advanced Packaging and Systems (ICAPS, SPIE vol. 4828), Reno, NA, pp. 231-6, March 10-13, 2002.
  33. "Partitioning Digitally Programmable Power-Control for Applications to Ballasts," D.C. Hopkins and J. Moronski, Proc. of the Int'l Applied Power Electronics Conference, Dallas, TX, March 11-14, 2002.
  34. "Characterization of Advanced Materials for High Voltage / High Temperature Power Electronics Packaging," D.C. Hopkins and J. S. Bowers, Proc. of the Int'l Applied Power Electronics Conference, Anaheim, CA, March 4-8, 2001, pp. 1062-1067
  35. "Packaging Factors for Next Generation High Voltage, High Temperature Power Electronics Modules," J.S. Bowers, D.C. Hopkins and W.J. Sarjeant, Proc. of the High Temperature Electronics Conference, Albuquerque, NM June, 2000.
  36. "A Four - Dimensional Road-Mapping Framework for Power Packaging Technology," D. C. Hopkins, S. C. O Mathóna, A. N. Alderman, Proc. of the 1998 IMAPS Int’l Symp. on Microelectronics, San Diego, CA, Nov. 1-4, 1998.
  37. "A High Speed Pulser Thyristor," A. H. Craig, D. C. Hopkins and J. C. Driscoll, Proc. of the Int’l Applied Power Electronics Conference, Anaheim, CA, February 15-19, 1998.
  38. "Power Packaging of a 12 kV, 240 ° C, Passive Electronic Module," J. S. Bowers, D. C. Hopkins and W. J. Sarjeant, Proc. of the Int’l Applied Power Electronics Conference, Anaheim, CA, February 15-19, 1998.
  39. "A Framework for Developing Power Electronic Packaging," D. C. Hopkins, S. C. OMathuna, A. N. Alderman and J. Flannery, Proc. of the Int’l Applied Power Electronics Conference, Anaheim, CA, February 15-19, 1998; Plenary Session
  40. "Thermal Resistance and Stress due to Variations in Layer Thicknesses," D. C. Hopkins, J. M. Pitarressi and J. A. Karker, Proc. of the 1997 ISHM (IMAPS) Int’l Symp. on Microelectronics, Philadelphia, PA, Oct. 12-16, 1997.
  41. "Packaging Issues for next Generation High Voltage, High Temperature Power Electronics Modules," J. S. Bowers, D. C. Hopkins and W. J. Sarjeant, Proc. of the Int’l Applied Power Electronics Atlanta, GA, February 23-27, 1997.
  42. "System Design Considerations for using a Direct–Attached–Ceramic MMC Power Package," D. C. Hopkins, J. M. Pitarressi, D. R. Fridline and J. A. Karker, Proc. of 32nd Int’l Power Conversion Conference, Nürnberg, Germany, pp. 683–690, May 21–23, 1996.
  43. "Development of a Three Dimensional Power Circuit Package for Aircraft Applications," D. C. Hopkins, R. Revis, 1994 ISHM Int’l Symp. on Microelectronics, Boston, MA, pp. 124–128, November 15–17, 1994; awarded Best Paper of Session.
  44. "A Mathematical Approach to Minimize the Total Mass of a Space Based Power System by Using Multivariate Nonlinear Optimization," D. C. Hopkins, M. Sarkar, 29th Intersociety Energy Conversion Engineering Conf., Monterey, CA, August 7–12, 1994.
  45. "Synthesis of a New Class of Converters That Utilize Energy Recirculation," D. C. Hopkins and D. W. Root, Proc. of the 1994 IEEE Power Electronics Specialists Conference, Taipei, Taiwan, pp. 1167–1172, June 20–24, 1994.
  46. "Determining Conductor Thickness in Power Circuits that Operate at Long Wavelength Frequencies," D. C. Hopkins and S. H. Bhavnani, Proc. of the 1993 ISHM Int’l Symp. on Microelectronics, Dallas, TX, pp. 656–661, November 9-11, 1993.
  47. "Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN, Al2O3 and BeO Assemblies," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Proc. of the 1992 ISHM Int’l Symp. on Microelectronics, San Francisco, CA, pp. 577-583, October 19-21, 1992; awarded Best Paper of Session.
  48. "Numerical Modeling and Experimental Comparison of Copper Bonded AlN, Al2O3 and BeO Power Hybrid Structures," D. C. Hopkins, S. H. Bhavnani and K. H. Dalal, Proc. of the 1992 Int’l Electronics Packaging Conf., Austin, TX, September 27-30, 1992.
  49. "The Use of Equalizing Converters for Serial Charging of Long Battery Strings," D. C. Hopkins, C. R. Mosling, S. T. Hung, IEEE Applied Power Electronics Conference, Dallas, Texas, March 10-15, 1991; Invited Paper.
  50. "The Effects of Power Hybridization on Power Electronic Circuits," D. C. Hopkins, ISHM Int. Symposium on Microelectronics Proceedings, Baltimore, MD, pp. 647-654, October 1989.
  51. "The Microelectronics Program at Auburn University," R. W. Johnson, D.C. Hopkins and R. C. Jaeger, ISHM Int. Symposium on Microelectronics Proceedings, Baltimore, MD, pp. 367-375, October 1989; Best Paper of Session.
  52. "Power-Hybrid Design of a High-Frequency ZCS-QRC," D.C. Hopkins, M. M. Jovanovic, F.C. Lee and F. W. Stephenson, Proc. of the Fourth Annual High Frequency Power Conversion Conference, Naples, FL, pp. 304-317, May 14-18, 1989.
  53. "Plated Copper on Ceramic for Power Hybrid Applications," R. Weeks, R. W. Johnson and D.C. Hopkins, 39th Electronic Components Conference Record, Houston, TX, May 1989.
  54. "Thick-Film Power Hybridization of Switchmode Power Circuits," D, C, Hopkins, Proceedings of the IEEE Applied Power Electronics Conference, Baltimore, MD, pp. 249-255, March 13-17, 1989.
  55. "Printing of Thick Thick-Film Conductors for Power Hybrid Circuits," D.C. Hopkins, F.W. Stephenson and F.C. Lee, ISHM Int. Symposium on Microelectronics Proceedings, Seattle, WA, pp. 95-101, October 1988; Best Paper of Session.
  56. "Determination of Conductor Thickness and Width for Power-Hybrid Circuits," D. C. Hopkins, F. W. Stephenson and F. C. Lee, Proc. of the Sixth Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 71-83 September 26-28, 1988.
  57. "Off-Line ZCS-QRC Thick-Film Hybrid Circuit," D. C. Hopkins, F. W. Stephenson and F. C. Lee, Proc. of the Sixth Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 71-83 September 26-28, 1988.
  58. "Design Aspects for High-Frequency Off-Line Quasi-Resonant Converter," M. M. Jovanovic, D.C. Hopkins and F. C. Lee, Proceedings of the Second Annual High Frequency Power Conversion Conference, Washington, D.C., pp. 83-97, April 1987.
  59. "Two-Megahertz Off-Line Hybridized Quasi-Resonant Converter," D.C. Hopkins, M. M. Jovanovic, F.W. Stephenson and F.C. Lee, Proceedings of the IEEE Applied Power Electronics Conference, pp. 105-114, March 1987.
  60. "One-Megahertz, Off-Line Converter Hybridization," D. C. Hopkins, M. M. Jovanovic, F. W. Stephenson and F. C. Lee, Proc. of the Fourth Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 134-148, November 4-5, 1986.
  61. "Status of Power Devices, IC's and Support Chips," D. C. Hopkins, Proc. of the Second Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 2-9, September 13-14 1984.
  62. "Status of Semiconductor Power Switching Devices," D. C. Hopkins, Proc. of the First Annual Power Electronics Seminar, Virginia Power Electronics Center, Blacksburg, VA, pp. 82-91, October 12-13, 1983.
  63. "Protective Level Comparisons of Voltage Transient-Suppressors (120 Vac Type)," ITT Research Institute - Electrical Overstress Electrostatic Discharge Symposium Proceedings, San Diego, CA, pp. 35-43, September 1980.
  64. "A Multi-Megawatt Vacuum-Arc Switched Invertor for Airborne Applications," with R.N. Miller, et al., Proceedings of the 13th Pulse Power Modulator Symposium, June 1978.
  65. "Recent Results of Vacuum-Arc Switched Multi-Megawatt Inverter Tests," with A. S. Gilmour, et al., IEEE Pulsed Power Conference Proceedings, November 1976.