Printing of Thick Thick Film Conductors for Power Hybrid Circuits - ISHM '88 Proceedings
Description
This paper describes a technique for obtaining a conductor thickness of 50 microns (2 mils) with a single print. The conductor is silver based with a print resolution greater than 175 microns (7 mils) and an adhesion greater than 21N. The new process uses much of the traditional thick-film processing procedure. A technique is also described for printing a thick conductor in patterns of greater than 1.3mm (50 mils) wide.
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