Development of a Three Dimensional Power Circuit Package for Aircraft Applications - ISHM '94
The design of a card-mounted power supply having contact cooling along the narrow 20mm (0.8in.) edge of the card is described. The circuit was divided into three boards: transistors drivers, interconnection and power. The power board was designed to the 20mm edge height for contact cooling and the two other boards were designed to connect at right angles to the power board. A general discussion of three-dimensional (3D) packaging techniques for power is given. A specific technique is then described that uses posts on the power board to accept heavy-wire bonds on the power board and from the two orthogonal boards. Results of implementing the design in an aircraft supply application are given.