Development of a Three Dimensional Power Circuit Package for Aircraft Applications - ISHM '94

Description

The design of a card-mounted power supply having contact cooling along the narrow 20mm (0.8in.) edge of the card is described. The circuit was divided into three boards: transistors drivers, interconnection and power. The power board was designed to the 20mm edge height for contact cooling and the two other boards were designed to connect at right angles to the power board. A general discussion of three-dimensional (3D) packaging techniques for power is given. A specific technique is then described that uses posts on the power board to accept heavy-wire bonds on the power board and from the two orthogonal boards. Results of implementing the design in an aircraft supply application are given.

Latest works

Aluminium-Based High-Temperature (200C) Packaging for SiC Power Converters

High-Temperature, High-Density Packaging

A Four-Dimensional Road-Mapping Framework

A Framework for Developing Power Electronics Packaging

Development of a Three Dimensional Power Circuit Package for Aircraft Applications

Synthesis of a New Class of Converters That Utilize Energy Recirculation

Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN Al2O3 and BeO Assemblies

The Use of Equalizing Converters for Serial Charging of Long Battery Strings

Printing of Thick Thick Film Conductors for Power Hybrid Circuits