A Framework for Developing Power Electronics Packaging - IEEE '98
As the integration of electro-physical circuits increases, many physical components and topologies are either directly or indirectly determined by the electrical designer. This paper presents a packaging technology framework for designers to better understand, evaluate and communicate the technical needs for a ‘physical circuit’. The framework goes further in proposing a systematic method to link technical power packaging issues to user requirements as the basis for developing a Power Electronics Technology Roadmap. This paper presents the framework as a three-dimensional coordinate of User Requirements, Levels of Packaging, and Interfaces and Pathways, cross-cut by a fourth dimension of Energy Forms. Examples assist the reader in understanding the framework and appreciating the potential for application of the framework in the future developments of power electronics packaging.