High-Temperature, High-Density Packaging - IEEE '06

Description

This paper describes the design of a 60kW, actuator motor drive using high temperature SiC devices. Power JFET devices are selected for high-frequency performance and high density. High-density packaging uses an aluminum conductor, AlN substrate and AlSiC combination to minimize dissimilar interfaces. The forced air-cooled design provides >1.1kW/cu.in.

Latest works

Aluminium-Based High-Temperature (200C) Packaging for SiC Power Converters

High-Temperature, High-Density Packaging

A Four-Dimensional Road-Mapping Framework

A Framework for Developing Power Electronics Packaging

Development of a Three Dimensional Power Circuit Package for Aircraft Applications

Synthesis of a New Class of Converters That Utilize Energy Recirculation

Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN Al2O3 and BeO Assemblies

The Use of Equalizing Converters for Serial Charging of Long Battery Strings

Printing of Thick Thick Film Conductors for Power Hybrid Circuits