High-Temperature, High-Density Packaging - IEEE '06
Description
This paper describes the design of a 60kW, actuator motor drive using high temperature SiC devices. Power JFET devices are selected for high-frequency performance and high density. High-density packaging uses an aluminum conductor, AlN substrate and AlSiC combination to minimize dissimilar interfaces. The forced air-cooled design provides >1.1kW/cu.in.
Latest works
Printing of Thick Thick Film Conductors for Power Hybrid Circuits
The Use of Equalizing Converters for Serial Charging of Long Battery Strings
Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN Al2O3 and BeO Assemblies
Synthesis of a New Class of Converters That Utilize Energy Recirculation
Development of a Three Dimensional Power Circuit Package for Aircraft Applications
A Framework for Developing Power Electronics Packaging
A Four-Dimensional Road-Mapping Framework
High-Temperature, High-Density Packaging
 Packaging for SiC Power Converters.png)
Aluminium-Based High-Temperature (200°C) Packaging for SiC Power Converters