High-Temperature, High-Density Packaging - IEEE '06


This paper describes the design of a 60kW, actuator motor drive using high temperature SiC devices. Power JFET devices are selected for high-frequency performance and high density. High-density packaging uses an aluminum conductor, AlN substrate and AlSiC combination to minimize dissimilar interfaces. The forced air-cooled design provides >1.1kW/cu.in.

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